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Darbond Technology Co., Ltd engages in the research and development, production, and sale of electronic packaging materials in China. The company offers electronic-grade adhesives and functional thin-film materials, integrated circuit packaging, smart terminal packaging materials, new energy application materials, and high end equipment application products. It also offers solutions, including integrated circuit solutions panel display solutions, intelligent devices, and power battery solutions. The company also engages in research and development, manufacturing, and sale of thermal conductive interface materials. Darbond Technology Co., Ltd was founded in 2003 and is headquartered in Yantai, China.
交易所：Shanghai Stock Exchange。行业板块：Basic Materials。细分行业：Chemicals。最新股价：¥88.11。本页提供 德邦科技 的 DCF 现金流折现估值、相对估值历史分位、多维财务评分与 AI 辅助分析。